Semiconductor Inspection, Metrology and Test Handling Equipment
Semiconductor Inspection, Metrology and Test Handling Equipment
UmproTech supplies semiconductor inspection, metrology, AOI, X-ray, acoustic microscopy, tray handling, and IC package test handling equipment for U.S. semiconductor packaging, microelectronics, electronics assembly, R&D, pilot production, and manufacturing teams.
This collection focuses on advanced package AOI, wafer-level AOI, 2D X-ray inspection, 3D X-ray CT inspection, scanning acoustic microscopy, warpage and coplanarity measurement, substrate dimensional metrology, JEDEC tray handling, IC package test handling, power module assembly and test stations, and turnkey packaging inspection lines.
Common inspection and test applications
- AOI inspection for wafer-level and package-level workflows
- 2D X-ray and 3D X-ray CT inspection for electronics and packages
- Scanning acoustic microscopy inspection
- Warpage, coplanarity, and substrate dimensional metrology
- JEDEC tray handling, sorting, and IC package test handling
- Power module assembly and test support
How to choose inspection or metrology equipment
The right system depends on package type, substrate type, inspection goal, defect type, resolution needs, throughput target, cleanroom requirements, data reporting, traceability, operator training, support, and budget.
Quote, training and financing
UmproTech can prepare a delivered quote with inspection goal review, equipment configuration, cleanroom and layout discussion, installation/startup, operator training, support, and financing options. Financing may be available for qualified buyers, commonly with 24 to 60 month programs and possible 3 months no payments when applicable, subject to lender approval and final terms.
Request an inspection or test handling quote
Send package type, substrate type, inspection goal, defect types, throughput target, cleanroom requirements, delivery ZIP code, budget range, timeline, and whether you need installation, training, pilot line planning, or financing. Final pricing depends on stock, configuration, freight, taxes, tooling, integration, and written invoice terms.
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Find the right production class.
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Get the right machine before you spend the money.
Send material, thickness, size, power and production goals. We will return a practical machine and delivered-package recommendation.